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Website: http://www.acmrc.com/

ACM Research, Inc. was formed in January 1998 by a team of industry veterans specifically to focus on advanced copper metallization process technology, from which the company name is derived. ACM's Ultra ECP process technology provides the semiconductor industry with the ability to electroplate copper on thin (less than 50) seed layers with excellent uniformity. In addition to copper...More»

Address: 4378 Enterprise Street Fremont, CA 94538 Map it »

Phone: 510-445-3700

Email: info@acmrc.com

Founded: 1998

Industry: Consumer & Business Products

Sub-Industry: Other Business Products

Legal Structure: Corporation

Ownership: Private

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Stephen Chiao [x]

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Name:	ACM Ultra ECP System
Product URL:	http://www.acmrc.com/ecp.html
Description:	Ultra ECP® System Features * The tough electroplating challenge * ACM Research transcends these limits * In-situ film thickness uniformity monitor and control * Adaptive control for CMP Integration * Production-worthy system * 300-mm wafer compatibility * Robust software and outstanding graphical user interface * Ultra ECP® System brochure * Extending Copper Electroplating to 0.035 Micron... Technical Paper The tough electroplating challenge To meet the next level of device performance requirements, trench/via geometries must shrink to 0.13 µm or below. At the same time, manufacturing will move to 300-mm wafers. The challenge for electroplating is to fill every via/trench from the center to the edge of the wafer and to achieve thickness uniformity less than 1.5% at 1s. It's a challenge that current electroplating technology can't meet. ACM Research transcends these limitations ACM Research has developed technology that enables successful electroplating on seed layers from 500 Å down to 50 Å, with excellent uniformity (< 1% @ 1s). This technology is available in a production-worthy system that can plate on either PVD or CVD seed layers, on both 200-mm and 300-mm wafers. Based on patented technology, the Ultra ECP® system is the only one available that can plate on ultra thin seed layers. IC manufacturers can enjoy excellent electroplating results today, then move to smaller geometries whenever their technology roadmaps dictate. The Ultra ECP® system provides an extremely wide process window for 0.13-µm manufacturing. And it extends the electroplating process to 0.035-µm device geometries-and even beyond. In-situ film thickness uniformity monitor and control Only the Ultra ECP® system provides in-situ real-time monitoring and control of film thickness uniformity for each process wafer. The data is captured and can be exported in real time to the fab database. This unique capability enables much more sophisticated process control. And it is easily integrated with barrier/seed layer and CMP processes. Adaptive control for CMP integration To optimize plating for CMP, the Ultra ECP® system also provides automatic thickness profile tuning. This speeds up the tuning process and reduces tool qualification time. The user defines the desired final plating film thickness profile, including concave or convex profiles based on CMP tool polishing characteristics. Then the Ultra ECP® system automatically adjusts to produce that profile. Production-worthy system The team at ACM Research has extensive experience in semiconductor process technology and engineering, as well as manufacturing expertise. The result is a system that is very reliable and ready for the fab floor. Built to conserve clean-room floor and wall space, the Ultra ECP® is small and compact. The system is configured with three stacked plating modules and three stacked cleaning modules. The design provides for easy access and servicing, with many automated service procedures. One system for 200-mm and 300-mm wafers The Ultra ECP® system provides fast, easy conversion between 200-mm and 300-mm wafers, requiring minimal hardware changes and time. This offers IC manufacturers great flexibility and contributes to the system's low cost of ownership. Robust software and outstanding graphical user interface With its well-designed graphical interface, the robust, NT-based software control system is quite easy to use. It includes self-diagnostic and remote diagnostic capabilities, as well as built-in hardware/ software interlocks for fail-safe operation. It easily integrates with SECS/GEM. Developed by expert software engineers, the system is extremely reliable and well suited for the production environment.
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